Chemical Mechanical Polishing System
The Harmony-CMP 300 mm chemical mechanical polishing system applications include 300 mm pilot lines, slurry, pad, and recipe development, research on polishing new films/materials such as Cu and dual Damascene, low volume production, educational/research institutions, R&D labs, and non-semiconductor CMP polishing (such as MR heads). The machine's cluster tool design is a flexible platform. The system's primary polish module can be surrounded by future modules, providing features including a second polish table, cassette-to-cassette wafer handling, and post CMP wafer cleaning.
The module contains a 32-in.-dia. polishing table, manual wafer load and unload stations, pad conditioner, wet cleaning station, and a graphical user interface. The modules, along with slurry tanks and a vacuum system, is a stand-alone CMP system for manual wafer handling. Minimal floor space is required for the CMP; its footprint is 25 ft2. Since corrosion resistant materials are used throughout the system, it can be used for either metal or oxide CMP.
Strasbaugh, 825 Buckley Rd., San Luis Obispo, CA 93401. Tel: 805-541-6424; Fax: 805-541-6425.