Product/Service

CD-SEM System

Source: Applied Materials, Inc.
The VeraSEM system is designed for the automated measurement and imaging of sub-0.15 micron semiconductor device features

The VeraSEM system is designed for the automated measurement and imaging of sub-0.15 micron semiconductor device features. This metrology system provides monitoring of a range of process parameters.

This system utilizes process variation monitoring (PVM) technology that can speed customers' process development time and ensure better process control, according to the company. It is designed to handle both 200mm and 300mm wafer sizes, and is upgradable to measure sub-0.13 micron geometries for future technology requirements.

Using a column design and algorithms, PVM technology enables measurements to be made on the device, including line edge roughness, line edge width variation, and distinguishing open/closed contact holes. These PVM features can shorten the time for development and provide tighter control of lithography and etch processes.

This system operates with a high throughput that is achieved through the integration of a high-speed stage, wafer handling and measurement algorithms.

Applied Materials, Inc., 3050 Bowers Ave, Santa Clara, CA 95054. (408) 727-5555