CBT 6000® High Speed Large Area Ball Bonder

Palomar Technologies' CBT 6000 high speed, large area, thermosonic ball bonder redefines traditional measurements of wire bonding productivity. The true measure of productivity is net throughput. By utilizing the bonder's large work area, 152mm x 304mm (6" x 12"), Palomar has designed a series of innovative handling systems which eliminate indexing time, creating a unique non-stop bonding platform. Our large platform accommodates parts of all sizes, allowing for design flexibility.

"The Palomar CBT 6000 bonder marks a significant milestone in the MCM-D Consortium Program with the introduction of leading edge manufacturing technology to electronic packaging" Peter Ludlow, Director of the MCM D Consortium, sponsored by the Defense Advanced Research Projects Agency (DARPA), which collaborated with Palomar in achieving this new technology.

This ultra fast, accurate bonding technology is ideal for a wide variety of applications, including large complex hybrids and multichip modules (MCMs), display panels, automotive assemblies, disk drive assemblies, flex circuits, chip on board (COB), specialty leadframes, fine pitch, and IC devices.

Customer service assistance in evaluating proposed applications is available. Optional service contracts are available for extended labor warranty, preventive maintenance calls, or software updates. The full coverage service contract provides comprehensive, priority service.

Palomar Technologies, 2230 Oak Ridge Way, Vista, CA 92083-8341. Tel: 760-931-3600; Fax: 760-931-5191.