CBT 6000 Ball Bumping

The CBT 6000 Ball Bumping process represents an interconnect solution used in a variety of industries and applications. Features include Continuous Bonding Handlers, Wafer Teach Tools, and special software for Wafer Mapping, Ink Dot Recognition, and Security Bonding. The process can be used for Flip Chip applications, Ball in Corner Bonding, and placing security bonds.

For direct chip match applications, the large work area of the CBT 6000 allows an entire wafer to be bumped at one time. Its 300 x 150 mm work area accommodates wafer diameter ranges from 75, 100, 150, 200, and 300 mm. Special handlers allow the machine to bump one wafer while the other is indexing, the bonder only stops to index when the entire wafer is complete. Its Wafer Teach Tools reduces editing time. The machine, following the borders of the wafer, is taught a master die. The CBT 6000 then calculates the die that would fit in the wafer area and creates the appropriate number of duplicate die in the program. Changes to the master die's wire placement, PR points, or bond parameters automatically cascade to the duplicate die on the wafer.

Ball bumping requires a precise, repeatable ball. The CBT 6000 creates both an initial ball size and a final ball size repeatable to less than or equal to ± 2 microns. Additionally, it features a ball-forming algorithm, allowing the machine to bump with or without a tail. Deformation monitoring tracks the critical appearance of the bonds to ensure a repeatable process.

Palomar Technologies, 2230 Oak Ridge Way, Vista, CA 92083. Tel: 760-931-3600. Fax: 760-931-5191.