Ball Bonder

The CBT 6000 ball bonder represents an enabling technology for WsCSP. As the only wirebonder able to bond an entire wafer at a time, it offers a suite of WsCSP tools designed to meet the needs of the WsCSP market. By utilizing the product's high wire capacity, specialized wafer programming tools, wafer mapping, ink dot recognition, barcode scanning, wafer teach tools, deformation monitoring, and easy-to-use software, users can realize increased productivity and yield in their WsCSP programs.

In contrast to singulated chip processing, the CBT 6000's large 12 in. x 6 in. (304mm x 152mm) work area allows an entire wafer to be bonded at one time. Utilizing special dual lane handlers, it can bond a wafer in one lane, while a second wafer is indexing into the other lane. This "Continuous Bonding Technology" completely eliminates index time in wafers of 6 in. (152mm) diameter or less.

The product's wafer programming tools significantly reduce editing time. By training a master die and the borders of the wafer, the CBT 6000 will automatically calculate the array of dice that fir in the wafer area and add the appropriate number of "duplicate" die in the program. Changes to the master die's wire placement, PR points, or bond parameters will automatically cascade to the duplicate die in the program.

It also addresses the KGD issue through one of two features: Wafer Mapping and Ink Dot Recognition.

Wafer Mapping: It uses a fully automated process for wafer mapping. Utilizing a barcode system, it reads the die and selects the correct computerized wafer map. It will only bond to the known good die. On a high wire count die with low yield wafers, this can dramatically improve throughput.

Ink Dot Recognition: Rather than providing a wafer map, a fabrication house may mark the bad die with an ink dot. Utilizing the Pattern Recognition (PR), dice with ink dots are recognized as bad and are not bonded.

Palomar Technologies, 2230 Oak Ridge Way, Vista, CA 92083. Tel: 760-931-3600. Fax: 760-931-5191.