Axcelis Introduces Optima XE Single Wafer High Energy Ion Implanter

Beverly, MA - Axcelis Technologies, Inc. recently introduced the new Optima XE high energy ion implanter, the final component of Axcelis' Optima single wafer suite of tools. The Optima XE, which is available for shipment, provides a complete range of energy levels from 10keV to 4MeV. Its inherent flexibility and broad energy range allow a single tool to support chipmakers' dynamic high energy requirements for DRAM, NAND and NOR FLASH, embedded memory and logic device manufacturing.

"Axcelis has long been the principal supplier of high energy implant equipment with over 550 tools in production worldwide and at least 80% market share since 1996. The Optima XE positions us to extend our leading high energy position," said Mary Puma, chairman and CEO of Axcelis. "Furthermore, this marks the completion of our Optima tool suite, allowing us to meet the industry's full range of implant needs with equipment that provides excellent performance and productivity."

The Optima XE combines Axcelis' production-proven RF Linac high energy, spot beam technology with a high-speed, state-of-the-art single wafer endstation, enabling unmatched throughput. Axcelis' advanced spot beam ensures that all points across the wafer see the same beam at the same angle, resulting in exceptional process control and maximum yield. Axcelis is also introducing the Optima HE, a reduced energy version of the implanter.

SOURCE: Axcelis Technologies, Inc.