Aviza Technology Receives New Multiple System Etch Order From ASE

Scotts Valley, CA - Aviza Technology, Inc. recently announced it received a multiple system order for its Omega i2L etch system from the semiconductor packaging and test company, Advanced Semiconductor Engineering Incorporated, headquartered in Taiwan. ASE selected the Omega platform for its ability to provide the process and technology solutions for all key etch steps to meet ASE's advanced packaging requirements. This order marks another design win for Aviza in deep silicon etch applications.

ASE will use the etch systems in advanced packaging development, followed by implementation into its production fabs. The Omega i2L inductively coupled plasma (ICP) process module will be used for etching integrated passives, while the Omega i2L deep silicon (DSi) module will be used for through wafer via (TWV) etching to produce next-generation 3D stacked dies. The tools will be shipped to ASE's flagship Kaohsiung, Taiwan facility, which also houses the company's research and development center.

Due to scaling and low-k material limitations, TWV for 3D packaging is widely considered to be a key, enabling technology to manufacture higher performing chipsets in a smaller form factor. By creating vertical connections etched through a silicon wafer to integrate chip stacks, TWV technology results in improved performance, speed and functionality.

"Through Wafer Vias (TWV) or Through Silicon Vias (TSV) has become the focus of advanced package technology development as companies are realizing limitations in conventional packaging in terms of size reduction and performance improvement," said Brandon Prior, a senior consultant with Prismark Partners. "As companies sort though the manufacturing and business logistics challenges common with any new technology, we expect to see increased momentum and developments coming from leading IDMs, foundries and merchant packaging houses. Prismark expects several applications of 3D wafer technology to involve the use of integrated passives on die, or as part of a silicon interposer."

"3D packaging is an emerging growth market," said Kevin Crofton, Vice President and General Manager, PVD/CVD/Etch Business Unit of Aviza Technology, Inc. "Aviza is uniquely positioned in this arena, as our portfolio of etch and deposition systems provide us an opportunity to develop and deliver fully integrated process solutions for TWV applications. We concentrate a significant portion of our R&D spending to develop key TWV process steps including plasma etch, dielectric CVD liners, metal barrier and seed deposition, and we are very proud to have been selected by such a distinguished industry leader such as ASE. Aviza looks forward to supporting ASE's long-term development and production needs in advanced packaging."

SOURCE: Aviza Technology, Inc.