News | February 27, 2007

Aviza Technology Announces Shipment of Sigma fxP PVD System for Bulk Acoustic Wave Manufacturing

Scotts Valley, CA - Aviza Technology, Inc. a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, recently announced a follow-on shipment of its Sigma fxP physical vapor deposition (PVD) system to a leading U.S.-based supplier of devices for the communications market. The system will be used for production scale manufacturing of bulk acoustic wave (BAW) devices, primarily for use in the mobile communications market.

"We are very pleased to receive this repeat order from a leading manufacturer of BAW devices," said Kevin Crofton, Vice President and General Manager, PVD/CVD/Etch Business Unit of Aviza Technology, Inc. "We believe the leading manufacturers in this industry sector are beginning to see BAW filter development as a key component in the RF MEMS market. Aviza continues to be at the forefront in the development and commercialization of BAW applications, and we believe we have a strong position in this market segment with our growing installed base of BAW capital equipment, including our Sigma systems installed in Europe, the U.S. and Asia."

According to the companythe award-winning Sigma fxP is a single-wafer cluster tool designed for high-volume PVD processing, offering excellent process control with high throughput. It is a highly flexible system supporting various process chamber configurations and combinations to address a large variety of specific applications. Deposition process modules are based on a standard design that enables simple technology upgrades and wafer size conversions. Key applications for the Sigma fxP include Titanium/Titanium Nitride (Ti/TiN) liners and Aluminum (Al) interconnects for sub-0.35 micron node devices including ionized PVD liners for Tungsten (W)-Plug, very thick, flowed Al for power devices as well as highly uniform Aluminum Nitride (AlN) for BAW devices and Thin Film Heads.

Achieving excellent film uniformity for improved yield and growing the correct crystal structure, or texture, is critical for BAW processing. The Sigma fxP is designed to offer production-proven hardware and process technologies to deliver optimum uniformity and texture requirements that are fundamental to BAW manufacturers.

BAW technology has steadily gained momentum and continues to grow in significance to global semiconductor makers, with its primary application in the mobile communications market. The RF MEMS market is forecasted to reach $1.1B in 2009. The total market for BAW resonators, within the RF MEMS market segment, is forecasted to reach $524M in 2009. (Source: NEXUS Market Analysis for MEMS and Microsystems 2005 – 2009).

SOURCE: Aviza Technology, Inc.