Automatic Dual Head Wire Bonder
Source: Orthodyne Electronics
• Bonds to almost any electronic package requiring 100-500 micron (4-20 mil) wire.
• Bonds to almost any electronic package requiring 100-500 micron (4-20 mil) wire.
• Four-axis head allows bonding in any direction, to any type of module, leadframe or hybrid substrate.
• Programmable bonding parameters for each bond produce better bond quality and reliability.
• Programmable indexing and simplified tooling for fast, simple and repeatable production changeovers.
• Enhanced process control features can be individually modified for each bond.
• Orthodyne proprietary gray-scale pattern recognition system gives higher yield and throughput rates.
• Low maintenance bond head with no pivot bearing or solenoids to bind or wear.
• Enhanced diagnostics, statistics and wire handling features for better process control.
• Sophisticated, menu driven software is easy to program and modify.
• Options include non-destructive pull testing with exclusive built-in loop height detector, and destructive pull test mode.
• New clamp stations allow handling of matrix leadframe designs up to 72mm wide.
• ESEC autoline compatible with autoline option.
• SECS/GEM option available.
• Bonder can be configured for multiple bond head "in-line" concepts (3 head, 4 head, etc.)
• Four-axis head allows bonding in any direction, to any type of module, leadframe or hybrid substrate.
• Programmable bonding parameters for each bond produce better bond quality and reliability.
• Programmable indexing and simplified tooling for fast, simple and repeatable production changeovers.
• Enhanced process control features can be individually modified for each bond.
• Orthodyne proprietary gray-scale pattern recognition system gives higher yield and throughput rates.
• Low maintenance bond head with no pivot bearing or solenoids to bind or wear.
• Enhanced diagnostics, statistics and wire handling features for better process control.
• Sophisticated, menu driven software is easy to program and modify.
• Options include non-destructive pull testing with exclusive built-in loop height detector, and destructive pull test mode.
• New clamp stations allow handling of matrix leadframe designs up to 72mm wide.
• ESEC autoline compatible with autoline option.
• SECS/GEM option available.
• Bonder can be configured for multiple bond head "in-line" concepts (3 head, 4 head, etc.)
Orthodyne Electronics, 2300 Main Street, Irvine, CA 92614-6223. Tel: 949-660-0440; Fax: 949-660-0444.