Austin Semiconductor Launches iPEM Product Line
The first Austin Semiconductor product utilizing this packaging technology is a multi-chip (die) SDRAM-DDR with a total density of 1.2Gb and organized as 16M x 72/80, fitting a footprint of 32mm x 25mm and containing a total of 219 balls which constitutes the electro-mechanical interface. This device will be immediately followed by the availability of the single data rate version (SDR) and the 2.4Gb DDR device will follow in late "Q3-2006" within the same footprint. This initial product, a multi-source device, is the first of many products to be released utilizing this packaging technology and has been used as the springboard for all the product definitions to follow.
Future iPEM introductions will include additional memory only as well as sub-system definitions. Each definition based on the multi-chip on micro-laminate encapsulated in plastic packaging model or iPEM.
Austin Semi is currently sampling DDR266 devices at full military temperature range and DDR333 devices are available for the industrial temperature range. Production orders are being accepted now. Lead-time and unit pricing is available via all Austin Semiconductor sales channels.
SOURCE: Austin Semiconductor, Inc.