Auriga C

The Auriga C Planarization System provides complete dry-in/dry-out CMP processing in conjunction with high throughput and low cost of ownership advantages.

• Fully integrated post-CMP cleaner for dry-in/dry-out wafer polishing within the existing Auriga footprint
• Advanced process control increases effective throughput and eliminates wafer re-work by predicting accurate polish times
• Continuous wafer polishing improves effective tool throughput
• Class-one six-axis robot with dual end-effector to segregate dry load / unload and wet operations
• Two dual side PVA brush boxes remove particulates using common chemistries
• Brushes provide full front and back side wafer coverage with effective edge cleaning performance
• Rinse Ring design provides hydroplaning wafer movement with no mechanical contact
• Spin Rinse Dryer is fully enclosed, non-particulating, and supports optional megasonic cleaner
• Optional SMIF interface
• SECS-II & GEM compliance

SpeedFam-IPEC Corp., 405 North 54th St., Chandler, AZ 85226. Tel: 480-961-1600; Fax: 480-705-2733.