Atomic Layer Deposition Technology

Genus Inc. has announced its latest patented atomic layer deposition technology (ALD) critical for the next generation of semiconductor chips. ALD technology provides a demonstrated thickness control at the atomic level for logic and DRAM manufacturers for applications down to 0.1-micron feature sizes and beyond. Films are deposited with outstanding uniformity and conformality, even in extremely large aspect ratio structures. In addition, the technology is delivered on the established Lynx2 platform. Proven in high-volume production, the Lynx2 is a multiple film system with up to a four process module capability and a demonstrated high reliability in advanced manufacturing.

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