Product/Service

Atmospheric Robotics

Source: Brooks Automation
This line of atmospheric robotics components, which includes AcuTran 7, AquaTran 7 and AcuLigner 7, are designed for use in 200mm and 300mm semiconductor wafer manufacturing
Brooks Automationf atmospheric robotics components, which includes AcuTran 7, AquaTran 7 and AcuLigner 7, are designed for use in 200mm and 300mm semiconductor wafer manufacturing. Both AcuTran 7 and AquaTran 7 robots are expected to maximize tool throughput by leveraging the proprietary direct drive technology, time optimal DSP motion control, and continuous theta axis rotation features. The AcuLigner 7 can be used to work in conjunction with both robots to align 200mm and 300mm wafers in the Brooks Gemini Express bridge tool without mechanical adjustments.

The AcuTran 7 is designed for transporting 200mm and 300mm wafers in non-corrosive processing environments at atmospheric pressure. It is suitable for EFEMs (equipment front-end modules) found on 200mm/300mm cluster tools such as the Gemini Express bridge tool platform, and for Etch, PVD, CVD and RTP process tool applications. This robot also features off-center wafer pick/place capabilities, 2-link, SCARA arm and cassette mapping capabilities.

The 4-axis AquaTran 7 robot provides transport for 200mm and 300mm wafers at atmospheric pressure in wet, corrosive processing environments such as electroplating and cleaning systems. It features the same capabilities as the AcuTran 7, plus the ability for high-speed wafer inversion using the 4th axis of motion in the wrist, and resistance to corrosive environments.

AcuLigner 7 works in tandem with either the AcuTran 7 or AquaTran 7 robots to locate wafer centers and rotationally orient wafers to a user-specified angle for processing at atmospheric pressure. It is an integral component of the Gemini Express bridge cluster tool and can be used to align both 200mm and 300mm wafers without mechanical adjustments. It avoids wafer edge contact by using a three point servo-controlled passive support mechanism. Its design also enables it to be used to align 100 mm, 125mm and 150mm wafers, and numerous transparent and square substrates.

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