Atheros Enables WLAN Integration Into Mobile Handsets

Santa Clara, CA -- Spansion LLC, the Flash memory venture of AMD and Fujitsu Limited, and Atheros Communications, Inc. announced they have developed a packaging solution that is designed to reduce the size of today's dual-mode Cellular/Wireless LAN mobile phones. The packaging solution vertically stacks the Atheros Radio-on-Chip for Mobile 802.11a/g and 802.11g solutions with Spansion MirrorBit Flash memory. This solution enables handset manufacturers to provide new services, such as Voice-over-IP and WLAN data connectivity for download of content such as ring tones, music, video clips, games, and email, in small form factors.

Package-on-Package (PoP) solutions vertically stack system components for board savings, lower pin-count, simplified system integration and enhanced performance. The resulting PoP enables handset suppliers increased flexibility. The new PoP solutions based on the Atheros and Spansion devices will combine WLAN radio and baseband functions with the high-density code and data storage required by the vast majority of handset end-products -- in a small footprint measuring only 160 mm2. In comparison, a similarly configured solution using discrete chips can be as large as 800 mm2.

"Connectivity and content will drive adoption of next-generation cell phones," said Amir Mashkoori, senior vice president and general manager of Spansion's Wireless Solutions Division. "As handset manufacturers require more memory to enable new features and Wi-Fi to deliver the bandwidth necessary for consumers to access and download rich content and applications on their phones, Atheros and Spansion have each contributed to the ideal solution. Together, we expect both companies will play a key role in enabling cellular, Wi-Fi convergence."

Spansion offers a 12 x 12 mm package that integrates up to five different memory chips in a 128-ball solution with a 0.65 mm pitch. This package rests on top of an Atheros package, also measuring 12 x 12 mm, which provides the ROCm 802.11a/g and 802.11g (AR6001 family) Mobile WLAN chips in a 376-ball package with a 0.5 mm pitch.

"Our drive towards low power, low cost and small footprints is enabling high-performance WLAN technology in more handheld devices such as dual-mode phones," said Craig Barratt, president and chief executive officer of Atheros. "We are pleased to be working with Spansion, leveraging their technical expertise in developing advanced packaging solutions and success in mobile phone and handheld markets. Together we'll offer an innovative solution for integrating WLAN capabilities into new, smaller mobile phones with better performance and cost savings."

SOURCE: Atheros Communications, Inc.