Assembly Solutions

Featured at Semicon West

ESEC will debut four new equipment solutions at the show, including the ESEC Micron SC, a small footprint flip chip solution delivering ultra-high accuracy and speed; the ESEC 3008, an extremely fast fine pitch wire bonder performing at 60 µm ultra fine pitch applications and below; the 3018 Wire Bonder, an automation ready and extremely flexible wire bonder with a very large bond range of 2 in. x 2.5 in.; and ESEC's 2008 Die Bonder.

ESEC will also show the proprietary ESEC AUTOLINE11, featuring an automated assembly configuration of a die bonder (singulated BGA), wire bonders, plasma cleaner, and curing equipment. Additionally, an integrated line will demonstrate automated flexible die attach and packaging handling. The equipment on this line will include a CT-2000, a Zevatech 750 Flex Shooter, and loader and unloader equipment. Other equipment featured at the show includes a Micron 2 and leadbonder for Tessera's µBGA applications, and ESEC's high speed 2007 Die Bonder. A video presentation, entitled "Launching New Solutions," illustrates ESEC's product and service solutions to current and future needs in semiconductor assembly and will run throughout the show.

ESEC Inc., 9830 S. 51st St., Phoenix, AZ 85044. Contact: Kent Connell, 602-893-6990; Fax: 602-893-6793.