Apollo

Trion Technology's new production stripping system incorporates:

• A high density inductively-coupled plasma (ICP) source. Trion's hybrid ICP source introduces power into the plasma downstream from the wafer. Thus, eliminating charge damage and providing fast strip rates. Our unique design provides superior performance to other common systems on the market.(patent pending)
  
• RIE biased electrode
  
• Electrostatic chuck with helium backside cooling
  
• A production proven multi-axis atmospheric robot - designed for increased throughput and reliability, 2 and 3-link arms, maximum radial reach of 24", maximum vertical stroke of 20" transports 150mm, 200mm, and 300mm, wafers.
  
• PC process controller that provides simple and reliable system control with a graphical software package that creates programs in block diagram form. Process recipes are stored on 3.5" disks allowing each operator to maintain individual recipes.

System specifications: 18"Wx50"Dx51"H
Maximum wafer size: up to 8"

This single-chamber system with its flexible multi-axis robot, reliable dry pump and unique inductively-coupled hybrid reactor provide an inexpensive solution to your thoughest stripping requirements.

Trion Technology, 1025 South 52nd Street, Tempe, AZ 85281. Tel: 480-968-8818; Fax: 480-968-5596.