AlBa Aluminum-Backed Aluminum Targets

• Operates at higher power and is lighter in weight then traditional copper-backed targets.
• A better coefficient of expansion match between the aluminum target and aluminum backing plate, yielding a high strength assembly.
• Minimized bond layer stress.
• Designed for one-time use. It is simply recycled or disposed of -- not returned.
• Eliminates dimensional problems associated with recycled copper backing plates.
• For use in the MRC, Novellus (Varian) and Anelva systems.

AlBa Aluminum Bonding Technology

AlBa  features a high purity aluminum target solder-bonded to a disposable high strength aluminum backing plate instead of a traditional, heavier copper backing plate

Tosoh SMD, Inc., 3600 Gantz Road, Grove City, OH 43123. Tel: 614-875-7912; Fax: 614-875-0031.