900 series
Source: KDF Electronic & Vacuum Services
The 900 series, dual loadlock, in-line, sputter down, batch systems are configured with an optional high vacuum loadlock
The 900 series, dual loadlock, in-line, sputter down, batch systems are configured with an optional high vacuum loadlock and three or four target positions. High-rate DC magnetron sputtering, single pass or multiple-pass deposition and dual-level high vacuum pumped loadlock features make the tools versatile, high-throughput production systems. Cathode and wafer orientation are horizontal, thereby allowing the sputtered material to be transferred vertically. The 900 SERIES systems are popular for pure metal and oxide target deposition and the convenient wafer to pallet loading ability. The 900 series includes the 903NT, 943NT, 944NT, 954NT and the 954NTX. The NTX series systems offer an extended sputter area to increase process uniformity. The 944NT and 94NT offer up to four target capability.
KDF Electronic & Vacuum Services, 10 Volvo Drive, Rockleigh, NJ 07647. Tel: 201-784-5005; Fax: 201-784-0202.
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