Product/Service

8250HT Medium Current Ion Implanter

Source: Eaton Corp., Semiconductor Equipment Div.
The 8250HT high-tilt, medium-current ion implanter is designed for 0.18µm and below processes.
The 8250HT high-tilt, medium-current ion implanter is designed for 0.18µm and below processes. Building on the production-proven technology of the 8250 product platform, the 8250HT is the most flexible, productive and reliable system available for manufacturers of advanced ICs. The "HT" refers to the implanter's improved capabilities for high throughput in high-tilt implants. The implanter's unique processing capabilities make it an adaptable medium-current implanter for channel and drain engineering implantation.

The fully automated, serial-processing system is designed to maximize productivity and minimize all forms of contamination. The system employs the company's patented Extended Life Source (ELS), which provides unmatched source lifetime and beam currents. The system is capable of delivering sufficient beam currents between 4µA and 3,500µA to run at mechanical limits for all high-tilt medium-current applications. The system also maximizes tool utilization by processing a wide spectrum of species with an energy range from 3keV to 750keV- therefore, a dedicated implanter for indium processes is not required. Further, the system achieves a mechanically limited throughput of 210 wafers per hour independent of the lot size and allows manufacturers to reach uniformity specifications of 0.5 percent.

The superior beam energy and chemical purity performance demonstrated by the system is achieved with its unique Angular Energy Filter (AEF), which deflects the beam by 15 degrees and eliminates contamination before it reaches the wafer. The AEF enables the 8250HT to achieve beam energy and chemical contamination levels that are typically below metrology detection levels when operating in either deceleration or acceleration mode. This capability adds a substantial amount of flexibility to manufacturing processes through fully utilizing the entire implant energy range without the fear of energy contamination.

The mechanical scanning system, ELS and control system of the system make it the most productive high-tilt, medium-current implanter available for a production environment. The closed-loop, servo-controlled mechanical scan system delivers superior throughput for high-tilt applications and delivers tight uniformity and beam parallelism performance at high-tilt angles with larger wafer sizes. The patented ELS provides a beam current typically 1.5 to two times higher than one of an enhanced bernas source and the source lifetime can be two to eight times longer. The 8250HT's multi-tasking control system allows uninterrupted production while editing recipes, accessing data such as SPC or communicating with factor host systems.

The company's existing medium-current product line includes the 8250- a 200mm system that provides enhanced yield and serial processing advantages to users for high-tilt, medium-current implants and indium implants; and the MC3- a 300mm implanter that provides both the advanced technology and robust performance required for emerging and future device generations.

Eaton Corporation, Semiconductor Equipment Operations, 55 Cherry Hill Dr., Beverly, MA 01915-1053. Tel: 978-232-4000. Fax: 978-232-4200.