8-inch OMNI Wet Processing Tool

CFM's OMNI™ tool provides superior wet processing capabilities and cost savings. All of its features listed below combine to deliver the lowest Cost of Ownership (CoO) compared to other wet processing technologies. Totally enclosed single chamber – The wafer processing chamber provides a sealed environment to process wafers, eliminating air-liquid interfaces and exposure to ambient air between process steps. This enclosed environment ensures ultra-clean processing, complete process control, and process flexibility. Completely cassetteless operation – The wafer-processing carrier is loaded with wafers via a transfer system, creating a cassetteless vessel. At no point during processing do wet wafers move from the sealed, contamination-free environment.

Watermark-free IPA drying – CFM's Direct-Displace™ drying technology uses IPA vapor in the sealed chamber to deliver completely dry, watermark-free wafers.

Minimum cleanroom footprint – The OMNI™ tool is a completely modular system that allows several modules to be located in a "gray area," minimizing needed and costly cleanroom space.

High flexibility – A broad range of recipes can be programmed and selected with zero changeover time, allowing users to conveniently utilize one tool for multiple applications or multiple variations of one application.

High throughput – The 8-inch OMNI™ tool is designed to process up to 150 8-inch wafers in a single, totally enclosed processing chamber. Throughput is as high as 300 wafers per hour for some recipes.

CFM Technologies, Inc., 150 Oaklands Blvd., Exton, PA 19341. Tel: 610-280-8300; Fax: 610-280-8309.