744NT
Source: KDF Electronic & Vacuum Services
The 744NT is a large area four target, batch sputtering system
The 744NT is a large area four target, batch sputtering system, designed for processing high-density interconnect, 200 mm semiconductor wafers and flat panel displays (FPD). The 744NT is also equipped with a high-vacuum loadlock with a pre-heat substrate that enables the high throughput of the tool. The 744NT offers a usable area of 18 x 18 inches with a compact footprint that uses less than one-third the floorspace of competing equipment. The tool can hold four 200 mm wafers or multiple smaller wafers and features two processing palettes, allowing instantaneous change of wafer sizes and the ability to process both the front and back side of the wafer.
KDF Electronic & Vacuum Services, 10 Volvo Drive, Rockleigh, NJ 07647. Tel: 201-784-5005; Fax: 201-784-0202.
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