3D Wafer Bump Inspection System

Designed for high-speed bump and wafer inspection, the system incorporates the Company's patent-pending three-dimensional (3D) Rapid Confocal Sensor™, with proprietary two-dimensional (2D) bump and active die inspection technologies to provide bump manufacturers with high-speed and high accuracy combined in a single bump inspection solution.

The 3Di-8000 quickly and accurately measures the height and coplanarity of solder and gold bumps, also called wafer level interconnects, which provide the critical electrical connection between the die and a package or circuit board. In addition, the 3Di-8000 incorporates 2D inspection capabilities for characteristics such as bump placement and size, as well as active die area inspection. The system is capable of inspecting wafers from 75 to 300 millimeters, bridging the transition to larger wafer sizes.

The bumping process allows die interconnects to be manufactured at the wafer level, providing a cost savings from the economies of scale to both manufacturers and end users.

August Technology, 4900 West 78th Street, Bloomington, MN 55435. Tel: 952-820-0080; Fax: 952-820-0060.