3D Metrology Scanning Electron Microscope

The VeraSEM 3D Metrology SEM (scanning electron microscope) is an in-line production-worthy CD (critical dimension)- SEM system to provide three dimensional imaging technology.

In addition to measure CDs, the microscope images the sidewall profile of device features down to 100 nanometers (0.1 micron) with up to 10x greater resolution of the slope than existing SEMs. Achieving in seconds what takes hours to do by costly off-line analysis, the product enables chipmakers to realize higher yields and reduce costs through the early detection of process excursions.

Unlike other profile viewing techniques that require off-line destructive testing, such as cross-section SEMs, the unit allows chipmakers to rapidly monitor wafers between process steps and automatically alert operators to marginal or out-of-spec conditions. The system's in-line operation also saves costs by potentially eliminating the need for numerous, expensive test wafers. The microscope is also expected to be key to emerging copper applications where maintaining slope shape is critical for preventing voids in dual damascene structures.

The unit also features fully automated, 'operator free' operation, high throughout, shared database, offline programming and online data analysis. The system's design accepts both 200mm and 300mm wafers with minimal changes.

Applied Materials, Inc., 3050 Bowers Ave., Santa Clara, CA 95054-3299. Tel: 408-727-5555. Fax: 408-748-9943.