300mm Transistor Solutions
Source: Applied Materials, Inc.
A comprehensive product line has been introduced for manufacturing advanced transistor structures on 300mm wafers
Applied Materials, Inc.sive product line has been introduced for manufacturing advanced transistor structures on 300mm wafers. These 300mm-ready systems combine RTP (rapid thermal processing), ion implantation, epitaxial deposition, and low pressure chemical vapor deposition (LPCVD) technologies with innovations in factory efficiency.
For epitaxial deposition, the Epi Centura 300 system extends the technology of the company's 200mm Epi Centura system.
Single-wafer LPCVD allows chipmakers to decrease a wafer's thermal exposure relative to batch furnaces, providing better control over dopant diffusion, which is critical for maintaining electrical performance. The SiNgen Centura 300 system provides silicon nitride deposition for advanced front-end applications and is an alternative to batch furnaces for sidewall spacer, etch stop, shallow trench isolation layers and other applications in 0.13 micron and below devices. The SACVD Producer 300 is a high throughput CVD system for transistor dielectric CVD films such as shallow trench isolation oxides.
Quantum 300 family of ion implant systems offers a combination of low beam energies and an enhanced beamline for high throughput, including the Quantum LEAP ultra-low energy (200ev to 80Kev) technology. The systems can be used in combination with the Radiance Centura system to enable precise creation of ultra-shallow junctions at and below 0.13 micron.
<%=company%>, 3050 Bowers Avenue, Santa Clara, CA 95054-3299. Tel: 408-727-5555; Fax: 408-748-5119
For epitaxial deposition, the Epi Centura 300 system extends the technology of the company's 200mm Epi Centura system.
Single-wafer LPCVD allows chipmakers to decrease a wafer's thermal exposure relative to batch furnaces, providing better control over dopant diffusion, which is critical for maintaining electrical performance. The SiNgen Centura 300 system provides silicon nitride deposition for advanced front-end applications and is an alternative to batch furnaces for sidewall spacer, etch stop, shallow trench isolation layers and other applications in 0.13 micron and below devices. The SACVD Producer 300 is a high throughput CVD system for transistor dielectric CVD films such as shallow trench isolation oxides.
Quantum 300 family of ion implant systems offers a combination of low beam energies and an enhanced beamline for high throughput, including the Quantum LEAP ultra-low energy (200ev to 80Kev) technology. The systems can be used in combination with the Radiance Centura system to enable precise creation of ultra-shallow junctions at and below 0.13 micron.
<%=company%>, 3050 Bowers Avenue, Santa Clara, CA 95054-3299. Tel: 408-727-5555; Fax: 408-748-5119
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