Product/Service

300mm Transistor Solutions

Source: Applied Materials, Inc.
Applied Materials, Inc. has introduced its product line for manufacturing advanced transistor structures on 300mm wafers
Applied Materials, Inc.erials, Inc. has introduced its product line for manufacturing advanced transistor structures on 300mm wafers. These 300mm-ready systems combine RTP (rapid thermal processing), ion implantation, epitaxial deposition, and low pressure chemical vapor deposition (LPCVD) technologies with innovations in factory efficiency.

The systems cover virtually all of the processing applications required for transistor fabrication. For epitaxial deposition, the Epi Centura 300 system extends the technology of the company's 200mm Epi Centura system.

The SiNgen Centura 300 system provides silicon nitride deposition for advanced front-end applications and is an alternative to batch furnaces for sidewall spacer, etch stop, shallow trench isolation layers and other applications in 0.13 micron and below devices. The SACVD Producer 300 is a high throughput CVD system for transistor dielectric CVD films such as shallow trench isolation oxides.

The Radiance Centura 300 system provides temperature uniformity for 0.13 micron feature sizes and beyond. The system offers a full range of production processes, ranging from implant annealing of ultra shallow junctions made with ultra low energy implants to several oxidation processes for growing the highest quality oxides in very thin layers, such as those used in ultra-thin gate stack structures.

Applied Materials, Inc.erials' Quantum 300 family of ion implant systems offers a combination of low beam energies and an enhanced beamline for high throughput, including the revolutionary Quantum LEAP ultra-low energy (200ev to 80Kev) technology.

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