300mm SMIF Products

Introduced at Semicon Europa '98

Asyst Technologies, Inc., a supplier of mini-environment and SMIF-based technology to the worldwide semiconductor industry, has introduced three additions to its suite of 300 mm products. The Asyst SMIF-Pod 300 is a 25-wafer-capacity front opening unified pod (FOUP). Two new productivity enhancement options to the SMIF-300FL (Front Load) are the SMIF-300SL (Spin Load) and wafer mapping. The newest members of the Asyst SMIF-300 Series meet all Semiconductor Equipment and Materials International (SEMI) and International 300 mm Initiative (I300I) guidelines. All products are designed to work in conjunction with Asyst's SMIF-300 Series products to help increase manufacturing productivity and yields.

The Asyst 300 mm FOUP leverages the experience and proprietary technology of Asyst's SMIF-Pod product family, delivering a clean, reliable and cost-effective wafer carrier solution for 300 mm wafer fab customers. The SMIF-Pod 300 is designed to meet the needs of 0.18 micron and smaller device manufacturing. According to Asyst, the company's static dissipative feature has successfully eliminated electrostatic discharge (ESD) events in the pods. Additional pod features include ultra-low outgassing and a patented pod latch system, which optimizes locking security without particulate generation. Integrated SEMI-compatible gas purging features enable simple incorporation of the gas purge option. The SMIF-Pod 300 also offers a choice of carrier auto identification options including the infrared-based Asyst SMART-Tag, barcode or radio frequency.

The SMIF-300SL and integrated wafer mapping options reduce tool footprint and cycle time. Asyst's retro-reflective wafer mapping system provides highly accurate wafer mapping and incorporates a Class 1-rated laser system. The wafer mapping option graphically displays results and detects the location of wafers, as well as cross-slotted wafers between any two adjacent slots. These features are designed to reduce wafer handling errors and increase process yields. Asyst's wafer mapping approach, using servo-controlled door movements, has no impact on tool throughput.

Asyst Technologies, Inc., 48761 Kato Road, Fremont, CA 94538. Tel: 510-661-5000; Fax: 510-661-5160.

SMIF: Standard Mechanical InterFace, the material handling approach that enables wafer transfer to and from sealed SMIF environments without exposure to cleanroom ambient conditions. SEMI standards exist for 150, 200 and 300 mm wafer sizes.
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