300mm Product Line for Advanced Interconnect Applications
Source: Applied Materials, Inc.
Seven new 300mm production systems that cover all the dielectric and metal deposition steps required to fabricate advanced interconnects are being introduced
Applied Materials, Inc.00mm production systems that cover all the dielectric and metal deposition steps required to fabricate advanced interconnects are being introduced.
These systems deposit virtually all of the widely used dielectric plasma CVD films as well as HDP-CVD (high-density plasma-CVD) and SACVD (sub-atmospheric CVD) technologies. The 300mm dielectric CVD product line includes the Ultima HDP-CVD Centura 300 and Producer S 300 which features integrated inspection options for film thickness and particle measurement. Both systems utilize a common factory interface module.
For low k technologies, the dielectric CVD product line will include Black Diamond, an advanced low-k CVD film technology that has recently demonstrated a dielectric constant below 2.4. Paired with the company's BLOk barrier low k film, Black Diamond enables the creation of low k stack structures and provides an easily integrated dielectric solution for dual damascene copper interconnect processing.
<%=company%>, 3050 Bowers Ave., Santa Clara, California 95054. Tel: 408-727-5555; Fax: 408-986-8352
These systems deposit virtually all of the widely used dielectric plasma CVD films as well as HDP-CVD (high-density plasma-CVD) and SACVD (sub-atmospheric CVD) technologies. The 300mm dielectric CVD product line includes the Ultima HDP-CVD Centura 300 and Producer S 300 which features integrated inspection options for film thickness and particle measurement. Both systems utilize a common factory interface module.
For low k technologies, the dielectric CVD product line will include Black Diamond, an advanced low-k CVD film technology that has recently demonstrated a dielectric constant below 2.4. Paired with the company's BLOk barrier low k film, Black Diamond enables the creation of low k stack structures and provides an easily integrated dielectric solution for dual damascene copper interconnect processing.
<%=company%>, 3050 Bowers Ave., Santa Clara, California 95054. Tel: 408-727-5555; Fax: 408-986-8352