300mm Process Diagnostics and Control Products
Source: Applied Materials, Inc.
Applied Materials, Inc. announces its full line of 300mm process diagnostics and control products for rapid, high-sensitivity, in-line wafer inspection and metrology
Applied Materials, Inc.erials, Inc. announces its full line of 300mm process diagnostics and control products for rapid, high-sensitivity, in-line wafer inspection and metrology. The VeraSEM 3D, SEMVision, Compass and Excite systems enable customers to achieve faster time to high yields and profitability through advanced process control.
The Compass 300mm system inspects patterned wafers. Designed for 0.10 micron and below technology, the system's OMNIView multi-perspective laser scanning technology detects the most critical yield-limiting defects while maintaining good throughput. The system's On-The-Fly (OTF) automatic defect grouping separates critical from nuisance defects for early correction and minimal yield loss.
The Excite 300mm system is a process tool monitoring system designed for detecting particles on both blanket (monitor) wafers and patterned (product) wafers. The system delivers rapid excursion detection at throughputs, equivalent to most process tools, enabling its use as an in-line particle detection system for one or more tools in high-volume production.
The SEMVision 300mm defect review scanning electron microscope (SEM) features Multiple-Perspective SEM Imaging (MPSI) to enable rapid re-detection of all defect types with accurate automatic defect classification (ADC). The system can review both unpatterned and patterned wafers with automatic energy-dispersive x-ray (EDX) for rapid root cause identification of process tool problems. An additional application, Automatic Process Inspection (API), enables the rapid review of process variations.
The VeraSEM 3D 300 mm critical dimension SEM (CD-SEM) system offers IC manufacturers early detection of process excursions at sub-0.10 micron geometries. The system features sidewall imaging technology for controlling slope profiles. The system utilizes electronic beam tilt to achieve the required speed for in-line monitoring and accuracy.
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The Compass 300mm system inspects patterned wafers. Designed for 0.10 micron and below technology, the system's OMNIView multi-perspective laser scanning technology detects the most critical yield-limiting defects while maintaining good throughput. The system's On-The-Fly (OTF) automatic defect grouping separates critical from nuisance defects for early correction and minimal yield loss.
The Excite 300mm system is a process tool monitoring system designed for detecting particles on both blanket (monitor) wafers and patterned (product) wafers. The system delivers rapid excursion detection at throughputs, equivalent to most process tools, enabling its use as an in-line particle detection system for one or more tools in high-volume production.
The SEMVision 300mm defect review scanning electron microscope (SEM) features Multiple-Perspective SEM Imaging (MPSI) to enable rapid re-detection of all defect types with accurate automatic defect classification (ADC). The system can review both unpatterned and patterned wafers with automatic energy-dispersive x-ray (EDX) for rapid root cause identification of process tool problems. An additional application, Automatic Process Inspection (API), enables the rapid review of process variations.
The VeraSEM 3D 300 mm critical dimension SEM (CD-SEM) system offers IC manufacturers early detection of process excursions at sub-0.10 micron geometries. The system features sidewall imaging technology for controlling slope profiles. The system utilizes electronic beam tilt to achieve the required speed for in-line monitoring and accuracy.
<%=company%>, 3050 Bowers Ave., Santa Clara, California 95054. Tel: 408-727-5555; Fax: 408-986-8352
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