300mm Etch Product Line

Applied Materials, Inc.erials, Inc. has announced its line of 300mm etch systems supporting all dielectric, silicon and metal etch applications. These systems offer proven etch process technologies that address current manufacturing requirements and provide extendibility to 0.10 micron chip geometries.

Each 300mm etch chamber is matched to the Centura 300 platform which is derived from Applied Materials, Inc.erials' production-proven Centura 200mm design. This platform utilizes a simplified modular format for easy access and serviceability. New surface-mount technology has been designed into the gas delivery system and integrated onto the mainframe, reducing overall system footprint.

Applied Materials, Inc.erials' 300mm dielectric etch systems, the Dielectric Etch eMax 300 and Dielectric Etch IPS 300, offer a broad range of high-productivity applications for sub-0.13 micron designs, including critical self-aligned contacts and bi-level contacts, small-geometry via, spacer and hardmask etches, as well as new low k materials and damascene structures. Modular chambers, advanced wafer chuck technology, superior temperature control and low consumables enable process capability and ensure the repeatability needed for high volume production.

The Metal Etch DPS 300 and Silicon Etch DPS 300 systems utilize the company's patented decoupled plasma source (DPS) technology. Using 200mm- chamber materials and surface coatings, the DPS 300mm chamber minimizes corrosion and defects, while its modular design enables ease of servicing. The Metal Etch 300mm system contains an integrated strip chamber, based on its 200mm ASP technology that rapidly removes photoresist and performs a passivation process that extends post-etch corrosion resistance.

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