300 MM REDUCED-PITCH FRONT-OPENING SHIPPING SYSTEM

The FabFit 300 is the industry's first reduced-pitch front-opening shipping box (FOSB) for 300 mm wafer handling. With a 25-wafer capacity, the new FabFit 300 FOSB is 40 percent smaller than standard-pitch 300 mm FOSBs. The pitch is just 6.35 mm compared with 10 mm for standard-pitch configurations. This shipping system features front interface mechanical standard (FIMS), which is accessed manually or through automation on the loadport. The FABFit 300 is the only FOSB with both FIMS automated interface door opening capability and secondary packaging to provide a fully integrated wafer shipping system.

The smaller configuration of the new FabFit FOSB means less footprint on the fab floor, reduced shipping costs and lower cost of ownership for end users. The 25-wafer capacity of the FabFit 300 is a 40 percent capacity increase over standard-pitch shipping systems. The FabFit 300 is approximately 44 percent lighter than standard-pitch FOSBs when fully loaded, weighing in at just 13.5 pounds compared with 18-19 pounds for a standard-pitch system. Its smaller design consumes less expensive cleanroom space and it enables greater ease of handling for fab engineers, thereby decreasing wafer damage potential inside the FOSB.

The FabFit 300 is primarily composed of polycarbonate materials, which ensure stability during the shipping process and the integrity of the FOSB during long-term wafer storage. The secondary packaging system uses a polymer suspension assembly to cushion wafer-filled FOSBs during shipment, providing a more environmentally friendly approach to shipping wafers by minimizing the use of foam.

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