100 WPH PVD System
Source: Novellus Systems Inc.
Novellus Systems Inc. has introduced the INOVA xT, a 300 mm
metallization system that delivers physical vapor deposition (PVD) solutions to the 0.10-micron technology node and beyond
Novellus Systems Inc.stems Inc. has introduced the INOVA xT, a 300 mm
metallization system that delivers physical vapor deposition (PVD) solutions to the 0.10-micron technology node and beyond. The industry's first 100 wafer per hour (wph) PVD system, INOVA xT delivers twice the throughput of any existing PVD system on the market. Leveraging the company's hollow cathode magnetron (HCM) technology, INOVA xT delivers a barrier/seed layer that enables fill of copper dual damascene interconnect structures at high aspect ratios.
metallization system that delivers physical vapor deposition (PVD) solutions to the 0.10-micron technology node and beyond. The industry's first 100 wafer per hour (wph) PVD system, INOVA xT delivers twice the throughput of any existing PVD system on the market. Leveraging the company's hollow cathode magnetron (HCM) technology, INOVA xT delivers a barrier/seed layer that enables fill of copper dual damascene interconnect structures at high aspect ratios.
The system's patented three-dimensional HCM source delivers a highly directional ionized flux that increases sidewall and bottom coverage and reduces overhang and asymmetry. This technology enables void-free electrofill with copper seed thicknesses as thin as 800 angstroms, increasing throughput and reducing cost of consumables. The HCM's directionality enables extendibility of the PVD barrier/seed to sub-0.10-micron devices. The combination of Novellus' SABRE xT electrofill system and the new INOVA xT deliver a complete metal deposition solution for copper dual damascene structures on 300 mm wafers.
<%=company%>, 3970 N. 1st St., San Jose, CA 95134. Tel: 408-943-9700; Fax: 408-943-3422.
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