Latest Headlines
-
Renesas Introduces Industry’s First General-Purpose 32-Bit RISC-V MCUs With Internally Developed CPU Core
3/26/2024
Renesas Electronics Corporation , a premier supplier of advanced semiconductor solutions, today announced the industry’s first general-purpose 32-bit RISC-V-based microcontrollers (MCUs) built with an internally developed CPU core. While many MCU providers have recently joined investment alliances to advance the development of RISC-V products, Renesas has already designed and tested a new RISC-V core independently, which is now implemented in a commercial product and available globally.
-
Alpha And Omega Semiconductor Announces XSPairFET Buck-Boost MOSFET For Higher Power USB PD 3.1 EPR Applications
3/26/2024
Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, today announced its AONZ66412 XSPairFET MOSFET designed for Buck-Boost converters in USB PD 3.1 Extended Power Range (EPR) applications.
-
Sivers Semiconductors Extends Partnership With Strategic Lead SATCOM Customer
3/21/2024
Sivers Semiconductors AB (STO: SIVE), a leading supplier of integrated chips and modules for the most advanced communications and sensor solutions, today announced that its subsidiary Sivers Wireless has signed a third product development agreement with its lead European Satellite Company.
-
Synopsys Expands Semiconductor IP Portfolio With Acquisition Of Intrinsic ID
3/20/2024
Synopsys, Inc. (Nasdaq: SNPS) today announced that it has completed the acquisition of Intrinsic ID, a leading provider of Physical Unclonable Function (PUF) IP used in the design of system-on-chips (SoCs).
-
Teledyne e2v HiRel Releases Catalog Radiation Tolerant S-Band (2 GHz to 5 GHz) Ultra-Low Noise Amplifier For Space Applications
3/6/2024
Teledyne e2v HiRel announces the availability of a rad-tolerant S-Band low noise amplifier, model TDLNA2050SEP that is ideal for use in demanding high reliability, space and radar applications where low noise figure, minimal power consumption and small package footprint are critical to mission success.
-
SEALSQ Announces At LEAP Its Intension To Establish An Open Semiconductors Assembly And Test (OSAT) Center In Saudi Arabia
3/4/2024
SEALSQ Corp ("SEALSQ" or "the Company"), a leader in semiconductors, PKI, and Post-Quantum technology, today announced a significant initiative to establish an Open Semiconductors Assembly and Test (OSAT) Center in Saudi Arabia, at LEAP, the world's premier technology event, which will take place from March 4-7 at the Riyadh Exhibition and Convention Center in the capital's Malham district, in Saudi Arabia.
-
CG Power And Industrial Solutions Limited, Renesas, And Stars Microelectronics, To Jointly Build Outsourced Semiconductor Assembly And Test Facility In India
2/29/2024
CG Power and Industrial Solutions Limited (“CG”), a part of Tube Investments of India Limited and the Murugappa Group; Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions; and Stars Microelectronics (Thailand) Public Co. Ltd (“Stars Microelectronics”), a Thailand-based Outsourced Semiconductor Assembly and Test (OSAT) provider; had recently signed a Joint Venture Agreement (JVA) to establish a Joint Venture (JV) to build and operate an OSAT facility in India.
-
Edgewater Wireless Selected To Join The Alliance Of Semiconductor Innovation Canada (ASIC)
2/29/2024
Edgewater Wireless Systems Inc., the industry leader in Wi-Fi Spectrum Slicing technology for residential and enterprise markets, is pleased to announce that it has joined the Alliance of Semiconductor Innovation Canada (‘ASIC’), an organization dedicated to promoting the Canadian semiconductor ecosystem.
-
Renesas Unveils Powerful Single-Chip RZ/V2H MPU For Next-Gen Robotics With Vision AI And Real-Time Control
2/29/2024
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, has expanded its popular RZ Family of microprocessors (MPUs) with a new device targeting high-performance robotics applications.
-
VeriSilicon NPU IP Is Shipped In Over 100 Million AI-Enabled Chips Worldwide
2/28/2024
VeriSilicon today announced that it has reached a milestone achievement with its Neural Network Processor (NPU) IP integrated into over 100 million AI-enabled chips across 10 major application sectors worldwide, including Internet of Things (IoT), wearables, smart TVs, smart home, security monitoring, servers, automotive electronics, smartphones, tablets, and smart healthcare.