Latest Headlines
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Semtech Collaborates With Console Connect To Expand Connectivity Coverage In Asia-Pacific
5/2/2024
Semtech Corporation, a high-performance semiconductor, IoT systems, and connectivity service provider, and Console Connect, a leading Network-as-a-Service (NaaS) platform, today jointly announced their collaboration which will expand Semtech’s connectivity coverage across the Asia-Pacific (APAC) region for its AirVantage Smart Connectivity service.
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Skylo Technologies Certifies Sony's Altair ALT1250 Chipset For Its Satellite Network
5/1/2024
Skylo Technologies, the pioneer in satellite network connectivity, today announces the certification of Sony Semiconductor Israel's (Sony) ALT1250 chipset as part of the Skylo Certification Program.
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Mobix Labs Launches The World's First High-Power SP10T RF Switch For The Land Mobile Radio Market
4/30/2024
Mobix Labs, Inc., a fabless semiconductor company developing next-generation connectivity solutions spanning wired and advanced wireless systems, today introduced the MBX3110 SP10T high-power radio frequency (RF) switch.
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Magnachip Boosts Its Extensive Automotive Product Lineup With The Release Of A New 40V MXT MV MOSFET
4/30/2024
Magnachip Semiconductor Corporation (“Magnachip” or “Company”) announced today the release of its new 40V MXT MV MOSFET1. With this latest addition, the Company now offers 13 MOSFET and IGBT products for a wide range of automotive applications (see the tables below).
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Rambus Expands Chipset For Advanced Data Center Memory Modules With DDR5 Server PMICs
4/29/2024
Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the availability of its new family of state-of-the-art DDR5 server Power Management ICs (PMICs), including an industry-leading extreme current device for high-performance applications.
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Guerrilla RF Completes Strategic Acquisition Of GaN Device Portfolio From Gallium Semiconductor
4/29/2024
Guerrilla RF, Inc. has finalized the acquisition of Gallium Semiconductor's entire portfolio of GaN power amplifiers and front-end modules. Effective April 26th, 2024, GUER acquired all previously released components as well as new cores under development at Gallium Semiconductor. Additionally, all associated intellectual property (IP) has been transferred to GUER as part of this portfolio acquisition.
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Micron, Biden-Harris Administration, U.S. Senate Majority Leader Schumer Announce $6.1B In CHIPS And Science Act Funding For Historic Planned Investment In Domestic Leading-Edge Memory Manufacturing In Idaho And New York
4/25/2024
Micron Technology, Inc. (Nasdaq: MU), one of the world’s largest semiconductor companies and the only U.S.-based manufacturer of memory, and the Biden-Harris Administration today announced that they have signed a non-binding Preliminary Memorandum of Terms (PMT) for $6.1 billion in funding under the CHIPS and Science Act to support planned leading-edge memory manufacturing in Idaho and New York.
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Self-Adapting USB 2.0 Signal Conditioner IC From Diodes Incorporated Saves Power And Simplifies System Design
4/25/2024
Diodes Incorporated (Diodes) (Nasdaq: DIOD) today announces the introduction of the PI5USB212, a USB 2.0 signal conditioner that operates from a supply voltage down to 2.3V. Designed for use in notebooks,
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Cadence And TSMC Collaborate On Wide-Ranging Innovations To Transform System And Semiconductor Design
4/24/2024
Cadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
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Transphorm And Weltrend Semiconductor Launch New Integrated GaN System-In-Packages
4/24/2024
Transphorm, Inc. (Nasdaq: TGAN), a global leader in robust GaN power semiconductors, and Weltrend Semiconductor Inc. (TWSE: 2436), the global leader in USB Power Delivery (PD) Controller Integrated Circuits (ICs) for Adapters, today announced the availability of two new GaN system-in-packages (SiPs).