Latest Headlines
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Teledyne e2v HiRel Releases Catalog Radiation Tolerant S-Band (2 GHz to 5 GHz) Ultra-Low Noise Amplifier For Space Applications
3/6/2024
Teledyne e2v HiRel announces the availability of a rad-tolerant S-Band low noise amplifier, model TDLNA2050SEP that is ideal for use in demanding high reliability, space and radar applications where low noise figure, minimal power consumption and small package footprint are critical to mission success.
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SEALSQ Announces At LEAP Its Intension To Establish An Open Semiconductors Assembly And Test (OSAT) Center In Saudi Arabia
3/4/2024
SEALSQ Corp ("SEALSQ" or "the Company"), a leader in semiconductors, PKI, and Post-Quantum technology, today announced a significant initiative to establish an Open Semiconductors Assembly and Test (OSAT) Center in Saudi Arabia, at LEAP, the world's premier technology event, which will take place from March 4-7 at the Riyadh Exhibition and Convention Center in the capital's Malham district, in Saudi Arabia.
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CG Power And Industrial Solutions Limited, Renesas, And Stars Microelectronics, To Jointly Build Outsourced Semiconductor Assembly And Test Facility In India
2/29/2024
CG Power and Industrial Solutions Limited (“CG”), a part of Tube Investments of India Limited and the Murugappa Group; Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions; and Stars Microelectronics (Thailand) Public Co. Ltd (“Stars Microelectronics”), a Thailand-based Outsourced Semiconductor Assembly and Test (OSAT) provider; had recently signed a Joint Venture Agreement (JVA) to establish a Joint Venture (JV) to build and operate an OSAT facility in India.
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Edgewater Wireless Selected To Join The Alliance Of Semiconductor Innovation Canada (ASIC)
2/29/2024
Edgewater Wireless Systems Inc., the industry leader in Wi-Fi Spectrum Slicing technology for residential and enterprise markets, is pleased to announce that it has joined the Alliance of Semiconductor Innovation Canada (‘ASIC’), an organization dedicated to promoting the Canadian semiconductor ecosystem.
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Renesas Unveils Powerful Single-Chip RZ/V2H MPU For Next-Gen Robotics With Vision AI And Real-Time Control
2/29/2024
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, has expanded its popular RZ Family of microprocessors (MPUs) with a new device targeting high-performance robotics applications.
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VeriSilicon NPU IP Is Shipped In Over 100 Million AI-Enabled Chips Worldwide
2/28/2024
VeriSilicon today announced that it has reached a milestone achievement with its Neural Network Processor (NPU) IP integrated into over 100 million AI-enabled chips across 10 major application sectors worldwide, including Internet of Things (IoT), wearables, smart TVs, smart home, security monitoring, servers, automotive electronics, smartphones, tablets, and smart healthcare.
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ROHM's EcoGaN™ Adopted In The 45W Output USB-C Charger C4 Duo From Innergie, A Brand Of Delta
2/26/2024
ROHM Semiconductor today announced the adoption of its 650V GaN device (EcoGaN™) in the C4 Duo, a 45W output USB-C charger from Innergie, a brand of Delta. Delta is a global provider of IoT-based Smart Green Solutions headquartered in Taiwan. ROHM’s EcoGaN device contributes to greater application performance, reliability, and miniaturization by providing higher efficiency in power supply systems.
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Vishay Intertechnology To Bring Industry-Leading SiC MOSFET Technology To APEC 2024
2/26/2024
Vishay Intertechnology, Inc. (NYSE: VSH) today announced that at the Applied Power Electronics Conference and Exposition (APEC) 2024, the company will be showcasing its broad portfolio of passive and semiconductor solutions that address the latest trends in power electronics — from energy harvesting, electric vehicle (EV) powertrains, and mass commercialization to efficient and effective power electronics for power tools and switching regulators that shorten the iterative design cycle.
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Applied Materials Expands Patterning Solutions Portfolio For Angstrom Era Chipmaking
2/26/2024
Today at the SPIE Advanced Lithography + Patterning conference, Applied Materials, Inc. introduced a portfolio of products and solutions designed to address the patterning requirements of chips in the “angstrom era.” As chipmakers transition to process nodes at 2nm and below, they increasingly benefit from new materials engineering and metrology techniques that help overcome EUV and High-NA EUV patterning challenges, including line edge roughness, tip-to-tip spacing limitations, bridge defects and edge placement errors.
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Alpha And Omega Semiconductor Announces Application-Specific EZBuck Regulator To Power Intel Meteor Lake And Arrow Lake Platforms
2/22/2024
Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today introduced its new application-specific EZBuck regulator.