LATEST HEADLINES

• NEO Semiconductor Introduces World's First Extreme High Bandwidth Memory (X-HBM) Architecture For AI Chips

  8/5/2025

  NEO Semiconductor, a leading developer of breakthrough memory technologies, today introduced the world's first Extreme High Bandwidth Memory (X-HBM) architecture for AI chips.

• UCIe Consortium Introduces 3.0 Specification With 64 GT/s Performance And Enhanced Manageability

  8/5/2025

  Universal Chiplet Interconnect Express (UCIe) Consortium, the open standard for interconnects between chiplets within a package, today announced the release of the UCIe 3.0 specification, marking the next stage in the evolution of its open chiplet standard.

• iDEAL Signs Technology Partner Agreement For SuperQ MOSFETs With Power System Specialist Richardson Electronics, Ltd

  7/31/2025

  iDEAL Semiconductor, a fabless power semiconductor company focused on delivering breakthrough efficiencies, has announced it will partner with Power and RF specialist, Richardson Electronics.

• Navitas Powers Xiaomi's Next Generation GaN Charger

  7/31/2025

  Navitas Semiconductor (Nasdaq: NVTS), the industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors, today announced that Xiaomi’s next-generation 90W GaN charger will be powered by Navitas’ GaNSense Control ICs.

• Rigaku Launches XTRAIA XD-3300 Mass Production For Semiconductor Market

  7/29/2025

  Rigaku Corporation, a global solution partner in X-ray metrology systems and a Group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”), has launched full-fledged commercial production of XTRAIA XD-3300, a high-resolution microspot X-ray diffraction system.