Accelerating demand for embedded security in industrial and automotive segments is driving the market for technologies such as secure microcontrollers (MCU) and trusted platform modules (TPM). ABI Research, a global tech market advisory firm, forecasts that total global shipments of secure embedded hardware will double by 2023, surpassing the 4 billion mark. TPMs are finally gaining momentum, notably in new industrial markets, after more than a decade since its standardization. It had largely become
Diodes Incorporated, a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic, analog and mixed-signal semiconductor markets, and Lite-On Semiconductor Corporation (“LSC”), a Taiwan-based supplier of “green” power-related discrete and analog semiconductor devices, recently announced the companies have entered into an agreement that provides for the acquisition of LSC by Diodes
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, recently announced its fourth-generation lithium-ion (Li-ion) battery management IC that offers unmatched lifetime accuracy
Adesto Technologies Corporation (NASDAQ: IOTS), a leading provider of innovative application-specific semiconductors and embedded systems for the IoT, announced that its FT 6050 Smart Transceiver system-on-chip (SoC) now natively supports LON®, LON/IP, BACnet/IP and BACnet MS/TP protocol stacks – uniquely enabling the popular LON and BACnet industrial protocols to communicate simultaneously over the highly reliable and widely adopted Free Topology (FT) channel
Lam Research Corp. (Nasdaq: LRCX) today announced new solutions to help customers increase chip memory density, which is needed for applications such as artificial intelligence and machine learning
Dialog Semiconductor plc, a provider of highly integrated power management, AC/DC power conversion, charging and Bluetooth low energy technology, recently announced its first-to-market Configurable Mixed-Signal IC (CMIC) for the automotive industry, the SLG46620-A
ON Semiconductor, energy efficient innovations, announced a sponsorship to IEEE Empower a Billion Lives (EBL), an interdisciplinary, biennial global competition to identify and promote innovative solutions to energy poverty
Cree, Inc. (Nasdaq: CREE) and ON Semiconductor Corporation (NASDAQ: ON) announced the execution of a multi-year agreement where Cree will produce and supply its Wolfspeed® silicon carbide wafers to ON Semiconductor, a global semiconductor leader serving customers across the spectrum of electronics applications. The agreement, valued at more than $85 million, provides for the supply of Cree’s advanced 150mm silicon carbide (SiC) bare and epitaxial wafers to ON Semiconductor for use in high-growth markets,
Cadence Design Systems, Inc. and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, recently announced that the Cadence analog/mixed-signal (AMS) IC design flow has achieved certification for UMC’s 28HPC+ process technology
GTAT Corporation, d/b/a GT Advanced Technologies (GTAT) and GlobalWafers Co., Ltd. (GWC) have entered into a long-term agreement whereby the expertise of both companies will combine to forge a new source of supply of silicon carbide wafers. GWC, already one of the world’s top producers of semiconductor wafer solutions, will now add 150mm silicon carbide to its offering, manufactured from bulk SiC crystal produced by GTAT
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