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|Top News Stories|
|STATS ChipPAC Rapidly Expanding Capacity And Technology Portfolio In China|
STATS ChipPAC Ltd. announced it is rapidly expanding both its manufacturing capacity in China and the depth of its technology portfolio for advanced laminate packages and System-in-Package (SiP) solutions...
|SUSS MicroTec Introduces The BlueRay Semiautomatic Probe System|
SUSS MicroTec AG has introduced the BlueRay semiautomatic wafer probe system, setting a new standard in z-axis accuracy and communication for high speed testing...
|Keithley Introduces Source-Measure Units For Multi-Channel Applications|
Keithley Instruments, Inc. announced a new platform that lowers the cost of test for a wide range of electronic component producers, including silicon and compound semiconductor manufacturers...
|AMI Semiconductor Opens Offshore Design Center In India |
AMI Semiconductor has expanded its design and development capabilities with the opening of an offshore design center in India. Based in Bangalore, the new design center enhances AMI Semiconductor's capabilities in designing ASIC and ASSP silicon solutions...
|New Semtech PPMU Devices Introduced|
Semtech Corp. announced a new family of three per-pin parametric measurement unit (PPMU) devices that feature fast settling times and a small form factor for a 40mA device which combine to lower the cost of test in automated test equipment...
|Cadence Helps Sequans Achieve Early Time To Market For SoC|
Cadence Design Systems, Inc. announced its Engineering Services team helped Sequans Communications, a startup fabless semiconductor company, meet a challenging time-to-market goal for a high-performance system on chip (SoC)...
|Fairchild Semiconductor Establishes Chicago Power Design Center|
Fairchild Semiconductor adds to its growing number of worldwide Global Power Resource Design Centers with the addition of the Chicago, Illinois laboratory. This design center provides expertise in quasi-resonant designs offering less noise, lower EMI and higher efficiency...
|Veeco And Picogiga Partner To Advance Gallium Nitride (GaN)-on-Silicon Technology|
Veeco Instruments Inc. and Picogiga International announced that they have entered into a joint development program designed to advance gallium nitride-on-silicon technology to meet emerging market needs...
|DuPont And Sanmina-SCI Ink Licensing Agreement For Buried Capacitance Technology|
DuPont Electronic Technologies announced an agreement with Sanmina-SCI to become a licensee of Sanmina-SCI’s patented Buried Capacitance technology. DuPont Interra HK polyimide laminates can now be used in the practice of Buried Capacitance technology...
|Microchip Technology Announces PIC Microcontroller For Passive-Keyless-Entry|
Microchip Technology Inc. announced a Flash, 8-bit PIC microcontroller with a 3-channel, transponder analog front end and an integrated KEELOQ cryptographic peripheral...
|Multilayer Mirrors for Extreme Ultra-violet|
NTT offers high quality Multilayer Mirrors for extreme ultra-violet wavelengths. Mirrors offered include high reflective multilayer mirrors, highly heat-resistant mirrors, Short-spacing mirrors, and mirrors with spherical or aspherical surfaces
|ThermoJet -- Precision Temperature Cycling System|
ThermoJet is a precision-controlled temperature forcing system from FTS that delivers an airstream of up to 20 SCFM to rapidly change the temperature of a product or Device Under Test (DUT)...
The HMP240 transmitters from Vaisala have been specially designed for reliable and fast dewpoint measurement at high humidities and/or rapidly changing temperatures where condensing water vapor has been a problem...
|Testing Services |
Utilizing various EPA test methods Combustion Controls Solutions & Environmental Services, Inc. provides compliance and performance testing required by local and federal regulatory agencies...
|Research Report: GaN HEMT Wafers|
|By NTT Science and Core Technology Laboratory Group |
GaN-based HEMTs offer a unique combination of high electron velocity and breakdown fields. Therefore, they have attracted a great deal of interest due to their potential for high-voltage microwave power applications such as cellular phone base stations, wireless internet access systems, and intelligent transport systems...
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