Gigaphoton Installs Excimer Laser In The U.S. For Advanced Semiconductor Package Processing

Oyama ( BUSINESS WIRE ) - Gigaphoton Inc. (headquarters: Oyama, Tochigi Prefecture; President and CEO: Tatsuo Enami), a manufacturer of light sources for semiconductor lithography, has announced that it has delivered an excimer laser for cutting-edge semiconductor package processing to a Japanese equipment manufacturer and that the equipment has been installed in the United States.

Gigaphoton has applied the semiconductor lithography light source technology it has cultivated to develop cutting-edge light sources for semiconductor package processing in semiconductor post-processing.

The latest lineup, G300K, is a KrF (248nm) excimer laser connected to equipment for processing semiconductor package substrates, achieving high output, high repetition rate, high operating rate, and long life. Processing using an excimer laser is mainly aimed at drilling fine holes and trenches with a diameter of 10μm or less, and is expected to be adopted in the manufacture of cutting-edge semiconductor packages using chiplets, the number of which is expected to increase in the future, mainly for servers.

Tatsuo Enami, President and CEO of Gigaphoton, said, "While Gigaphoton is researching and developing light sources for semiconductor lithography, we have also been exploring various possibilities for the use of excimer lasers in new fields. We will continue to accelerate our research and development with a view to expanding into new fields. As a manufacturer of light sources that are
essential to semiconductor manufacturing, we will continue to contribute to the industry by researching and developing new processes so that excimer lasers will become more widely used."

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