Newsletter | February 15, 2021

02.15.21 -- Devices Could Become Even Smaller, More Powerful With Method For Integrating 2D Materials

Most Popular News

• Devices Could Become Even Smaller, More Powerful With Method For Integrating 2D Materials

• Cellular IoT- And Bluetooth LE-Powered Device Enables Remote Monitoring Of Smart Power Grids

• Alpha And Omega Announces Type-C Power Delivery High Voltage Source Switch

• GOWIN Semiconductor Announces AEC-Q100 Automotive Grade FPGA Availability

• WISeKey Provides Remote ID For New Drones’ Digital License Plates

• Sequitur Labs Joins STMicroelectronics Partner Program

• Lattice FPGAs Bring Low Power Signal Bridging And Interface Management To Edge Devices

• Renesas Updates Popular R-Car V3H With Improved Deep Learning Performance

• Seoul Viosys Begins Mass Production Of 25Gbps VCSELs For 5G Communications Applications

• Arteris IP FlexNoC Interconnect And Resilience Package Supports Socionext’s 5nm Automotive Chip Production

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