RD Automation was founded in 1969 as an equipment manufacturer for the semiconductor industry.

The company is located in Piscataway, NJ and is engaged mainly in the design and manufacture of precision bonders for the semiconductor packaging industry. Research Devices is owned by company management.

RD Automation is a leader and innovator of high end flip chip die bonders for a variety of applications.
RD Automation was awarded patents in optical alignment and leveling, and it is believed to have established the largest market share in the world for this equipment.

With over 300 bonders sold, RD Automation possesses the highest level knowledge base and comprehension of any flip chip application. With a staff of approximately 35 employees, 15 of whom are engineers and programmers, RDA is catering to the most sophisticated applications. In the line of equipment currently produced one can find the
FCS 7400 and the CDB-50, the high end production oriented flip chip die bonders, and the M8 series of manual and semi automatic aligner bonders, including the M8-G for up to 125 Kg of force with
2 micron (<0.1 mill) placement accuracy. Among
RDA 's clients are companies such as IBM, AT&T, MOTOROLA, FORD, ROCKWELL, and HUGHES.

The company is profitable, financially strong, committed to it’s customers and their needs, and enjoys a good reputation among its clients.