Products and Services

The company's S200 systems with MatrixMetrology for CMP and etch provide an application-optimized set of metrology techniques. The systems combine small-spot ellipsometry, microspot reflectometry, and software optimized for CMP or etch. They deliver the robust pattern recognition, measurement speed, and thin-film measurement performance needed for these applications while providing a cost-effective solution for each process.

The S200 CMP system has a very small (5x10 µm) ellipsometer spot with its 633 HeNe laser ellipsometer for on-product substrate n and k measurement and a microspot (2.5 µm) visible reflectometer (470-905 nm) for high throughput (110 wph) film thickness measurement. The addition of the visible reflectometer enables high-throughput, unambiguous measurement of thicker films. The S200 Etch system combines the features of the S200 CMP plus a 780 nm laser ellipsometer and software optimized for etch-to-clear applications. The visible reflectometer provides single-recipe measurements of all forms of polysilicon, and the laser ellipsometer enables ultrathin trace residue (under etch) detection plus sensitive, accurate over-etch detection. Both systems feature fast and robust Zheng pattern reognition, which has excellent performance on low-contrast wafers and excellent immunity to color and contrast variation.

Rudolph Technologies, One Rudolph Rd., Flanders, NJ 07836. Tel: 973-691-1300. Fax: 973-691-5480.

Free Semiconductor Online Newsletter