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The SpeedFam-IPEC STG EP-300/200 IVSN Edge Polisher Type IV is equipped for notched or flat wafers. Each system can also accommodate an optional notch polishing station delivering particle free surface polishing while maintaining the same unit footprint and high throughput.

FEATURES / BENEFITS:

• Reduced wafer breakage in subsequent handling steps
• Reduced particulate contamination
• Higher thin film adhesion characteristics
• Improved photo resist process
• Improved device yields
• Si0₂ layer removed simultaneous to edge polish process
• Insured competitive edge to prime wafer manufacturers
• Adaptable to all wafer edge surface profiles including T-Profile

SpeedFam-IPEC Corp., 405 North 54th St., Chandler, AZ 85226. Tel: 480-961-1600; Fax: 480-705-2733.