Product/Service

Performance Characterization

Source: Advanced Interconnect Technologies
At AIT, we have the technology, capability, and staff to characterize your unique IC design.
Because of the market demand for even higher technology products, electronic packaging science has advanced to meet the need. It is no longer merely a protection device, but is an integral part of the system that it is used in and must be viewed as part of the system from the beginning of the design cycle. Determining the capability of a package for a given device requires tools, knowledge, and teamwork.

At AIT, we have the technology, capability, and staff to characterize your unique IC design. Electromagnetic, heat transfer and mechanical modeling and measurement tools are available to our staff to identify and specify the characteristics of our packages to insure the efficient and exact application of your device. The staff includes electrical, chemical, mechanical, and materials science disciplines that use sound, physics-based methods to determine the performance attributes necessary to enable your technology.

In this section you will find information on our characterization capabilities and methods. Data reports and performance databases are available for viewing, and more in-depth information can be obtained on specific packages by registering.

If you would like to contact us, drop us a line and let us know what we can do to provide you with the service and technology you demand.

Advanced Interconnect Technologies, 6800 Koll Center Parkway, Suite 220 , Pleasanton, CA 94566. Tel: 925-426-3100; Fax: 925-426-2323.