Products and Services

RSS

Rudolph Technologies developed a method for directly measuring the thickness of thin copper films, electroplated films, and barrier materials on product wafers. For copper film processing, PULSE Technology has been applied to thin PVD seed copper layers, electroplated bulk copper, and underlying PVD/CVD barrier films. In processes where copper layers and barrier layers such as Ta and TiN are deposited within a single deposition tool, MetaPULSE can simultaneously measure both films.

The industry also requires a metrology tool that measures a film's edge profile and thickness uniformity, particularly when evaluating electroplating processes. The MetaPULSE's measurement spot allows measurements to be made very close to the edge of the wafer and plating electrode. The tool uses the echoes of sound waves to simultaneously measure the thickness of all sublayers within a completed multilayer interconnect stack, and does not require the consumption of monitor wafers.

Rudolph Technologies, One Rudolph Rd, Flanders, NJ 07836. Phone: 973-691-1300; Fax: 971-691-5480.