Products and Services

The i-MP extends the PULSE ultrasonic metal film thickness metrology to CMP, CVD, and ECD, providing real-time integrated process monitoring. The i-SL extends proprietary laser spectroscopic ellipsometry to real-time integrated transparent film thickness metrology to CMP, low-K dielectric deposition, and advanced gate-stack deposition process tools.

Both of these integrated tools have a compact design and can be bolted onto the process tool with minimal impact on footprint. Software for both tools automatically flags out-of-spec wafers based on real-time multi-point measurements.

Rudolph Technologies, One Rudolph Road, PO Box 1000, Flanders, NJ 07836, Tel: 973-691-1300, Fax: 973-691-5480