Products and Services

Rudolph Technologies, Inc. offers 200 and 300 mm versions of the MetaPULSE metal cilm metrology system. The MetaPULSE C is optimized for current generation aluminum interconnect applications but can be field upgraded to measure copper and its related films. The MetaPULSE X Cu supports all aluminum interconnect processes and the silicides, ultra-thin barriers, and tungsten processes in addition to the barrier, seed, and electroplated copper processes used in advanced dual-damascene processes. Both are available in 200mm and 300 mm configurations. This provides a cost effective opaque film metrology roadmap for any customer moving from today's 200 mm aluminum interconnect processes to next-generation 300 mm and dual damascene semiconductor production.

The systems allow customers to purchase what they need now and have the assurance that they can upgrade or change processes later. This modular approach to toolset design accommodates individual tool roadmaps for decreasing linewidths, increasing wafer sizes, and expanding process technologies. The resulting "bridge tools" enable customers to develop their individualized roadmaps that follow general industry trends.

The system incorporates PULSE Technology, an ultrasonic technique that has proven extremely effective in nondestructively measuring thick and thin opaque films in the fab.

Applications include:

• measurements for all thick and thin opaque films with angstrom accuracy and subangstrom repeatability
• metal film thickness measurements before silicide formation and determination of silicide phase, regardless of whether copper or aluminum interconnect is used
• barrier/adhesion layer and bulk metal layer thickness measurements
• film property measurements such as density and roughness
• transparent ILD thickness measurements for dual damascene

Rudolph Technologies, One Rudolph Rd., Flanders, NJ 07836. Tel: 973-691-1300. Fax: 973-691-5480.

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