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The AvantGaard 676 combines single wafer processing technology and a unique orbital polishing technique to meet and exceed the semiconductor industry's most stringent planarization production requirements for both metal and oxide.

• Industry's highest efficiency and smallest footprint
• Multiple wafer polishing modules with quick-change carriers and polish pads
• Through-the-pad multiple chemical delivery for point of use slurry mixing
• Advanced graphical user interface with flexible recipe management system
• Closed loop wafer polish pressure control and independent head rotational control
• Endpoint detection capability -- motor current or optical
• S2-93 and CE Compliant
• Proven in high volume manufacturing environments for more than 3 years