Current Headlines

  1. Longsys Showcases Embedded Integrated Storage Innovations At MWC 2026 to Accelerate On-Device AI 3/3/2026

    Longsys (301308.SZ), a leading branded semiconductor memory enterprise, is showcasing its latest embedded integrated storage solutions at MWC 2026.

  2. embedUR systems And Alif Semiconductor Partner To Deliver The Industry's First End-To-End Edge AI Development Platform For Advanced Microcontrollers 3/2/2026

    embedUR systems today announced a partnership with Alif Semiconductor® to bring native support for Alif's Ensemble® Series of microcontrollers to ModelNova™ Fusion Studio, embedUR's end-to-end Edge AI development platform.

  3. PhotonIC Debuts Product Portfolio Based Upon Its Platform: Resiliency Of Optoelectronic Chip Supply-Chain™ (ROCS) 2/27/2026

    PhotonIC Technologies, a global fabless optoelectronic semiconductor company, today introduces a complete product portfolio leveraging its ROCS platform —engineered to give end customers greater control and predictability over performance scaling, geopolitical risks, and manufacturing strategy.

  4. Modus Test Partners With yieldWerx To Deliver Closed-Loop Socket To Silicon Correlation 2/26/2026

    Modus Test, a leader in advanced test socket testing solutions and performance validation, and yieldWerx, a semiconductor data and yield analytics platform, today announced a strategic partnership to help close the gap between test hardware and yield intelligence.

  5. Axcelis Unveils Purion H6: Next-Generation High Current Ion Implanter For Advanced Semiconductor Manufacturing 2/4/2026

    Axcelis Technologies, Inc. (NASDAQ:ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, today introduced the Purion H6™ high current ion implanter—engineered to meet the demands of next-generation semiconductor devices with unmatched purity, precision and productivity.

  6. Siemens Acquires Canopus AI To Bring AI-Based Metrology To Semiconductor Manufacturing 2/4/2026

    Siemens today announced the acquisition of Canopus AI, an innovator in computational and AI-driven metrology solutions, enabling semiconductor manufacturers to achieve new levels of precision and efficiency in wafer and mask inspection processes.

  7. Nova Announces Adoption Of Metrion® By Two Leading Global Manufacturers 1/29/2026

    Nova (Nasdaq:NVMI) a leading innovator in metrology and process control solutions for advanced semiconductor manufacturing, today announced the adoption of its Nova Metrion® platform by global leaders in Memory and Logic device production.

  8. Arasan Announces The Immediate Availability Of The Industry's First xSPI NOR + eMMC NAND Combo PHY IP 1/29/2026

    Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automotive SoCs, today announced the immediate availability of its xSPI + eMMC combo PHY IP. This IP integrates both xSPI and eMMC 5.1 PHY into a single, unified solution, enabling support for two different storage protocols within the same IP.

  9. SK Keyfoundry Launches 4th-Generation 200V High-Voltage 0.18 Micron BCD Process, Accelerating Expansion Into Automotive•AI Power Semiconductor Markets 1/28/2026

    SK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it has recently launched its fourth-generation 200V high-voltage 0.18-micron BCD (Bipolar-CMOS-DMOS) process and will begin full-scale product development with major domestic and global customers, targeting mass production within the year.

  10. EMASS Tapes Out 16nm ECS-DoT, Advancing Always-On Edge AI 1/28/2026

    EMASS, a Nanoveu subsidiary specializing in next-generation semiconductor technology, today announced the successful tape-out of its 16nm ECS-DoT system-on-chip (SoC).