Current Headlines

1. Buchanan Leads Bill To Ensure American Semiconductor Superiority In Space 6/21/2026

   Today,Congressman Vern Buchanan,Vice Chairman of the House Ways and Means Committee,Congresswoman Terri Sewell(D-Ala.) andCongresswoman Suzan DelBene(D-Wash.) introduced theSemiconductor Superiority Actto amend the Section 48D Advanced Manufacturing Investment Credit to explicitly include property and infrastructure for space-based semiconductor manufacturing,as first reported byBloomberg Tax.

2. NVIDIA And TSMC Bring AI Into Fabs To Advance Semiconductor Design And Manufacturing 5/31/2026

   NVIDIA today announced that TSMC, the world’s leading semiconductor company, is using NVIDIA accelerated computing and AI to advance semiconductor design and manufacturing.

3. Nordic Semiconductor Brings AI-Assisted Development To The Entire Product Lifecycle 5/28/2026

   Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, today brings AI-assisted development to all parts of the IoT device lifecycle.

4. USI Showcases Advanced SiC Chip-Embedded Packaging Technology At PCIM Europe 2026 5/27/2026

   USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions.

5. NOVOSENSE Presents Semiconductor Technologies For xEV Powertrain And ADAS At Automotive Engineering Exposition 2026 5/27/2026

   NOVOSENSE (688052.SH | 02676.HK) is exhibiting atAutomotive Engineering Exposition 2026, held fromMay 27 to 29atPACIFICO Yokohama, Booth No. 206.NOVOSENSE presents its automotive-grade automotivesemiconductorsolutions for xEV powertrain, ADAS, body electronics and lighting applications.

6. ISDN's IDI Dynamics Debuts High-Speed Laser Marker For Semiconductor Assembly And Test (OSAT) 5/26/2026

   IDI Dynamics, a subsidiary ofISDN Holdings Limited(SGX: I07 / 1656.HK), has launched its next generation High-speed Laser Marker for semiconductor chip packages, with a dual value proposition of delivering 2.5x higher marking speed and occupying 22% less physical footprint.

7. GlobalFoundries Launches Quantum Technology Solutions To Scale U.S. Quantum Manufacturing 5/21/2026

   GlobalFoundries (GF) today launched Quantum Technology Solutions, a new quantum business to scale the manufacturing capabilities the quantum industry needs to achieve utility-scale quantum computing.

8. AI Chip Energy Efficiency: Hoth Therapeutics Restructures As Rocket One Inc. To Enter The AI Semiconductor Infrastructure Market With Acquisition Of Exclusive Rights To Next Generation AI Semiconductor Acceleration Technology Built On Non-Volatile Nanomag 5/19/2026

   (NASDAQ:HOTH)("Hoth" or the "Company") today announcedthat it intends to change its name toRocket One,Inc.("Rocket One"),and to restructure its business topositionthe Company, through its recently formed wholly-owned subsidiary,to pursue opportunities in artificial intelligence infrastructure, next-generation semiconductor technologies, and ultra-low-power AI computing.

9. Analog Devices To Acquire Empower Semiconductor, Expanding Its Next-Generation High-Density Power Portfolio For The AI Era 5/19/2026

   Analog Devices, Inc. (NASDAQ:ADI) and Empower Semiconductor today announced that they have entered into a definitive agreement under which ADI will acquire Empower in an all-cash transaction for $1.5 billion.

10. JST Enhances Applications Lab With New Wafer Wet Processing Equipment 5/18/2026

    JST, a leading provider of wet benches, wafer cleaning, and processing tools for the semiconductor industry, today announced new additions and upgrades to its product and technology offerings in the JST Applications Lab.