Business Wire

  1. WIN Semiconductors And Presto Engineering Announce A Strategic Collaboration For GaAs Testing Services
    9/1/2010
    WIN Semiconductors Corp., the world's largest pure-play Gallium Arsenide (GaAs) foundry, and Presto Engineering, a leading semiconductor product engineering company, today announced a strategic collaboration to deliver characterization and testing services for companies developing products utilizing GaAs technology from WIN.
  2. Cree Demonstrates High Quality 150-mm Silicon Carbide Substrates
    8/30/2010
    Cree, Inc., announced today that it has achieved a major breakthrough in the development and wide scale commercialization of silicon carbide (SiC) technology with the demonstration of high quality, 150-mm SiC substrates with micropipe densities of less than 10/cm2.
  3. Prediction Of Intrinsic Magnetism At Silicon Surfaces Could Lead To Single-Spin Magnetoelectronics
    8/26/2010
    The integration of single-spin magnetoelectronics into standard silicon technology may soon be possible, if experiments confirm a new theoretical prediction by physicists at the Naval Research Laboratory (NRL) and the University of Wisconsin-Madison.
  4. Crystal IS, Inc. And Asahi Kasei Announce Joint Development Agreement
    8/12/2010
    Crystal IS, Inc., the leading developer of ultraviolet light emitting diodes (UVC LEDs), and Asahi Kasei Corp., the parent company of one of Japan's major diversified industrial groups, today announced the signing of a joint development agreement
  5. Rudolph Technologies Acquires Selected Assets Related To MKS Instruments’ Yield Dynamics Software Business
    8/11/2010
    Rudolph Technologies, Inc., a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, reported today it has acquired selected assets of the Yield Dynamics software business from MKS Instruments
  6. ESI Ships 9850TPIR+ Laser Link Processing System For DRAM Market
    7/29/2010
    Electro Scientific Industries, a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced shipment of its new 9850TPIR+ laser link processing system for the DRAM market
  7. SEMATECH And Carl Zeiss Demonstrate Mask Pattern Alignment And Registration To Enable Double Patterning Lithography
    7/29/2010
    SEMATECH and the Semiconductor Metrology Systems (SMS) division from Carl Zeiss announced today that Zeiss' next-generation photomask registration and overlay metrology system has successfully passed a key development milestone. The jointly developed system – called PROVE - demonstrated the measurement capability for advanced photomasks for the 32 nm node and below
  8. D2 Technologies and TrendChip Technologies Create VoIP-Enabled Solution For xDSL Integrated Access Devices
    7/27/2010
    D2 Technologies, the market leader in embedded software platforms that power IP communications, and TrendChip Technologies, the leading xDSL chipset provider, recently announced the availability of D2's vPort Gateway (GW) embedded VoIP software on TrendChip's TC3182 ADSL2+ processor. The combined solution allows OEMs/ODMs to quickly deliver advanced ADSL2+ Integrated Access Devices (IADs) that offer high-performance ADSL2+ and 802.11n with optimized carrier-grade VoIP functionality
  9. Virage Logic Expands Semiconductor IP Portfolio With Silicon-Proven SiANA Analog IP Offering
    7/27/2010
    SOC SUMMIT Virage Logic Corporation , the semiconductor industry's trusted IP partner, recently announced the expansion of its broad semiconductor IP product portfolio with the introduction of SiANA, a new offering of silicon-proven analog IP components essential for building multimedia consumer electronics devices
  10. NetLogic Microsystems Announces Breakthrough Multi-Core Processor Solution Which Integrates 128 nxCPUs™
    7/26/2010
    NetLogic Microsystems, Inc. , a worldwide leader in high-performance intelligent semiconductor solutions for next-generation Internet networks, recently announced the innovative XLP8128S multi-core communications processor solution that integrates 128 nxCPUs and over 160 programmable processing engines to deliver an unprecedented 160Gbps throughput and 240 million packets-per-second (Mpps) of intelligent application performance for next-generation 3G/4G mobile wireless infrastructure, enterprise, storage, security, metro Ethernet, edge and core infrastructure network applications

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